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Standard Products
UT54LVDS032 Quad Receiver
Data Sheet May 22, 2003
FEATURES q q q q q q q q >155.5 Mbps (77.7 MHz) switching rates +340mV differential signaling 5 V power supply TTL compatible outputs Ultra low power CMOS technology 8.0ns maximum propagation delay 3.0ns maximum differential skew Radiation-hardened design; total dose irradiation testing to MIL-STD-883 Method 1019 - Total-dose: 300 krad(Si) and 1Mrad(Si) - Latchup immune (LET > 111 M eV-cm2/mg) Packaging options: - 16-lead flatpack (dual in-line) Standard Microcircuit Drawing 5962-95834 - QML Q and V compliant part Compatible with IEEE 1596.3SCI LVDS Compatible with ANSI/TIA/EIA 644-1996 LVDS Standard
INTRODUCTION The UT54LVDS032 Quad Receiver is a quad CMOS differential line receiver designed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 155.5 Mbps (77.7 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The UT54LVDS032 accepts low voltage (340mV) differential input signals and translates them to 5V TTL output levels. The receiver supports a three-state function that may be used to multiplex outputs. The receiver also supports OPEN, shorted and terminated (100 ) input failsafe. Receiver output will be HIGH for all fail-safe conditions. The UT54LVDS032 and companion quad line driver UT54LVDS031 provides new alternatives to high power pseudo-ECL devices for high speed point-to-point interface applications.
q q q q
RIN1+ RIN1-
+ R1 -
ROUT1
RIN2+ RIN2-
+ R2 -
ROUT2
RIN3+ RIN3-
+ R3 -
ROUT3
RIN4+ RIN4EN EN
+ R4 -
ROUT4
Figure 1. UT54LVDS032 Quad Receiver Block Diagram
APPLICATIONS INFORMATION The UT54LVDS032 receiver's intended use is primarily in an uncomplicated point-to-point configuration as is shown in Figure 3. This configuration provides a clean signaling environment for quick edge rates of the drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic impedance of the media is in the range of 100. A termination resistor of 100 should be selected to match the media and is located as close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver into voltages that are detected by the receiver. Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities, as well as ground shifting, noise margin limits, and total termination loading must be taken into account.
R IN1R IN1+ R OUT1 EN R OUT2 R IN2+ R IN2VSS
1 2 3 4 5 6 7 8 UT54LVDS032 Receiver
16 15 14 13 12 11 10 9
V DD R IN4R IN4+ R OUT4 EN R OUT3 R IN3+ R IN3-
Figure 2. UT54LVDS032 Pinout
TRUTH TABLE Enables EN L EN H Input RIN+ - RIN X V ID > 0.1V V ID < -0.1V Full Fail-safe OPEN/SHORT or Terminated PIN DESCRIPTION Pin No. 2, 6, 10, 14 1, 7, 9, 15 3, 5, 11, 13 4 12 16 8 Name RIN+ RINROUT EN EN V DD V SS Description Non-inverting receiver input pin Inverting receiver input pin Receiver output pin Active high enable pin, OR-ed with EN Active low enable pin, OR-ed with EN Power supply pin, +5V + 10% Ground pin Output ROUT Z H L H
DATA INPUT
ENABLE
1/4 UT54LVDS032 RT 100 + DATA OUTPUT
1/4 UT54LVDS031
All other combinations of ENABLE inputs
Figure 3. Point-to-Point Application
The UT54LVDS032 differential line receiver is capable of detecting signals as low as 100mV, over a + 1V common-mode range centered around +1.2V. This is related to the driver offset voltage which is typically +1.2V. The driven signal is centered around this voltage and may shift +1V around this center point. The +1V shifting may be the result of a ground potential difference between the driver's ground reference and the receiver's ground reference, the common-mode effects of coupled noise or a combination of the two. Both receiver input pins should honor their specified operating input voltage range of 0V to +2.4V (measured from each pin to ground).
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Receiver Fail-Safe The UT54LVDS032 receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to TTL logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from appearing as a valid signal. The receiver's internal fail-safe circuitry is designed to source/ sink a small amount of current, providing fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver inputs. 1. Open Input Pins. The UT54LVDS032 is a quad receiver device, and if an application requires only 1, 2 or 3 receivers, the unused channel(s) inputs should be left OPEN. Do not tie unused receiver inputs to ground or any other voltages. The input is biased by internal high value pull up and pull down resistors to set the output to a HIGH state. This internal circuitry will guarantee a HIGH, stable output state for open inputs.
2. Terminated Input. If the driver is disconnected (cable unplugged), or if the driver is in a three-state condition, the receiver output will again be in a HIGH state, even with the end of cable 100 termination resistor across the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable picks up more than 10mV of differential noise, the receiver may see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not differential, a balanced interconnect should be used. Twisted pair cable offers better balance than flat ribbon cable. 3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V differential input voltage, the receiver output remains in a HIGH state. Shorted input fail-safe is not supported across the common-mode range of the device (VSS to 2.4V). It is only supported with inputs shorted and no external common-mode voltage applied.
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ABSOLUTE MAXIMUM RATINGS1 (Referenced to VSS ) SYMBOL V DD VI/O T STG PD TJ JC II PARAMETER DC supply voltage Voltage on any pin Storage temperature Maximum power dissipation Maximum junction temperature 2 Thermal resistance, junction-to-case3 DC input current LIMITS -0.3 to 6.0V -0.3 to (V DD + 0.3V) -65 to +150C 1.25 W +150C 10C/W
10mA
Notes: 1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability and performance. 2. Maximum junction temperature may be increased to +175C during burn-in and steady-static life. 3. Test per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS SYMBOL V DD TC V IN PARAMETER Positive supply voltage Case temperature range DC input voltage, receiver inputs DC input voltage, logic inputs LIMITS 4.5 to 5.5V -55 to +125C 2.4V 0 to V DD for EN, EN
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DC ELECTRICAL CHARACTERISTICS 1 (VDD = 5.0V +10%; -55C < TC < +125C) SYMBOL V IH VIL VOL V OH IIN PARAMETER High-level input voltage Low-level input voltage Low-level output voltage High-level output voltage Logic input leakage current (TTL) (TTL) IOL = 2mA, V DD = 4.5V IOH = -0.4mA, V DD = 4.5V Inputs, V IN = 0 and 2.4V, V CC = 5.5 Enables = EN/EN= 0 and 5.5V, V CC = 5.5 V TH3 VTL 3 II IOZ4 V CL IOS 3 ICC4 I CCZ 4 Differential Input High Threshold Differential Input Low Threshold Receiver input Current Output Three-State Current Input clamp voltage Output Short Circuit Current Loaded supply current receivers enabled Loaded supply current receivers disabled V CM = +1.2V V CM = +1.2V V IN = 2.4V Disabled, VOUT = 0 V or VDD ICL = +/-18mA Enabled, V OUT = 0 V2 EN, EN = V DD or V SS Inputs Open EN = VSS, EN = VDD Inputs Open mA 11 -100 -10 -10 -1.5 -15 +10 +10 1.5 -130 11 4.0 -10 -10 +10 +10 CONDITION MIN 2.0 0.8 0.3 MAX UNIT V V V V A
+100
mV mV V mA mA
Notes: 1. Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground. 2. Output short circuit current (IOS ) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not excee d maximum junction temperature specification. 3. Guaranteed by characterization. 4. Device tested at VCC = 5.5V only.
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AC SWITCHING CHARACTERISTICS1, 2, 3, 4 (VDD = +5.0V + 10%, TA = -55 C to +125 C) SYMBOL tPHLD tPLHD tSKD tSK14 tSK24 tTLH 4 tTHL 4 tPHZ4 tPLZ 4 tPZH4 tPZL 4 PARAMETER Differential Propagation Delay High to Low CL = 20pf (figures 4 and 5) Differential Propagation Delay Low to High CL = 20pf (figures 4 and 5) Differential Skew (tPHLD - tPLHD ) (figures 4 and 5) Channel-to-Channel Skew1 (figures 4 and 5) Chip-to-Chip Skew5 (figures 4 and 5) Rise Time (figures 4 and 5) Fall Time (figures 4 and 5) Disable Time High to Z (figures 6 and 7) Disable Time Low to Z (figures 6 and 7) Enable Time Z to High (figures 6 and 7) Enable Time Z to Low (figures 6 and 7) MIN 1.0 1.0 0 0 MAX 8.0 8.0 3.0 3.0 7.0 2.0 2.0 20 20 20 20 UNIT ns ns ns ns ns ns ns ns ns ns ns
Notes: 1. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs. 2. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z0 = 50 , t r and tf (0% - 100%) < 1ns for R IN and tr and t f < 6ns for EN or EN. 3. CL includes probe and jig capacitance. 4. Guaranteed by characterization. 5. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
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R IN+ Generator 50 50 Receiver Enabled R INR CL R OUT
Figure 4. Receiver Propagation Delay and Transition Time Test Circuit or Equivalent Circuit
R IN0V Differential R IN+ tPHLD V ID = 200mV +1.2V
+1.3V +1.1V
tPLHD 80% 1.25V R OUT 20% tTLH
VOH 80%
1 .25V 20% V OL tTHL
Figure 5. Receiver Propagation Delay and Transition Time Waveforms
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EN
V DD
R IN+
2K
R IN-
20pf 2K
Figure 6. Receiver Three-State Delay Test Circuit or Equivalent Circuit
EN when EN = VDD
1.25V
1.25V
V DD 0V VDD
1.25V EN when EN = VSS tPLZ Output when VID = -100mV Output when V ID = +100mV tPHZ 0.5V
1.25V 0V tPZL 50% V DD VOL tPZH 0.5V 50% VSS V OH
Figure 7. Receiver Three-State Delay Waveform
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PACKAGING
Notes: 1. All exposed metalized areas are gold plated over electroplated nickel per MIL-PRF-38535. 2. The lid is electrically connected to VSS. 3. Lead finishes are in accordance to MIL-PRF-38535. 4. Package dimensions and symbols are similar to MIL-STD-1835 variation F-5A. 5. Lead position and coplanarity are not measured. 6. ID mark symbol is vendor option. 7. With solder, increase maximum by 0.003.
Figure 8. 16-pin Ceramic Flatpack
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ORDERING INFORMATION UT54LVDS032 QUAD RECEIVER:
UT 54LVDS032- * *
***
Lead Finish: (A) = Hot solder dipped (C) = Gold (X) = Factory option (gold or solder)
Screening: (C) = Military Temperature Range flow (P) = Prototype flow
Package Type: (U) = 16-lead Flatpack (dual-in-line)
Access Time: Not applicable
Device Type: UT54LVDS032 LVDS Receiver
Notes: 1 . Lead finish (A,C, or X) must be specified. 2 . If an "X" is specified when ordering, then the part marking will match the lead finish and will be either "A" (solder) or "C" (gold). 3 . Prototype flow per UTMC Manufacturing Flows Document. Tested at 25C only. Lead finish is GOLD ONLY. Radiation neither tested nor guaranteed. 4 . Military Temperature Range flow per UTMC Manufacturing Flows Document. Devices are tested at -55C, room temp, and 125 C. Radiation neither tested nor guaranteed.
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UT54LVDS032 QUAD RECEIVER: SMD
5962 - 95834
** * * *
Lead Finish: (A) = Hot solder dipped (C) = Gold (X) = Factory Option (gold or solder) Case Outline: (X) = 16 lead Flatpack (dual-in-line) Class Designator: (Q) = QML Class Q (V) = QML Class V
Device Type 02 = LVDS Receiver
Drawing Number: 95834 Total Dose (R) = 1E5 rad(Si) (F) = 3E5 rad(Si) (G) = 5E5 rad(Si) (H) = 1E6 rad(Si) Federal Stock Class Designator: No Options Notes: 1.Lead finish (A,C, or X) must be specified. 2.If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold). 3.Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening.
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